Mfg. Part No.: 14265
Brand: Devcon
5 Minute Epoxy Gels, 50 mL, Dev-Pak, Amber. Thixotropic, nonmigrating gel adhesive with excellent gap filling properties. High tensile strength. Good solvent resistance. Non-sagging adhesive. Fills gaps to .25 inch. Fast curing for bond tags on machinery and equipment. Adhesive Tensile Shear=2,500 psi. Applicable Materials=Wood; Most Metals; Ceramic; Fabric; Concrete; Steel; Aluminum; Copper; Ferrites. Applications=Multi-Purpose. Capacity Vol. [Nom]=50 mL. Chemical Compound=Epoxy. Color=Opaque. Dielectric Strength=440 V/mil. Fix Cure Time @ Temp.=1 h @ 75 °F. Full Cure Time @ Temp.=16 h @ 75 °F. Gap Fill [Nom]=1/4 in. Hardness [Nom]=80 Shore D. Packing Type=Dev-Pak™. Resistance=Kerosene; Sulfuric Acid-10%; Toluene; Hydrochloric Acid 3%. Temp. Range [Max]=200 °F. Temp. Range [Min]=-40 °F. Viscosity [Nom]=150,000 cP. Working Time [Max]=7 min. Working Time [Min]=4 min. Working Time [Nom]=4-7 min. Wt.=0.2 lb. .
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